| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a013f27aee93b16ee05c95b0d161b734 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85186
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05553
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48471
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06506
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49111 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-85
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488 |
| filingDate |
2012-04-25^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98973e2bf06d4b82d6b4e9e4601ab2d8 |
| publicationDate |
2013-11-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201344864-A |
| titleOfInvention |
Wafer assembly structure and wafer assembly method |
| abstract |
A wafer assembly structure includes a circuit board and a wafer on the circuit board. A plurality of first pads are formed on the circuit board, and a plurality of second pads respectively corresponding to the first pads are formed on the wafer. Two first solder balls are formed on each of the first pads. Each of the second pads is connected to the corresponding first pad by two bonding wires. One end of the two bonding wires is respectively connected to the two first solder balls, and the other end is connected to the second bonding pad by thermocompression bonding. The invention also relates to a wafer assembly method. |
| priorityDate |
2012-04-25^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |