http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201400401-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd446fb0d73aa96d044fea2eaa3c8ebc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-0018 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00674 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00261 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C3-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0771 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48463 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00246 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B3-004 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02 |
| filingDate | 2013-04-23^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_410afea8f9d81cd1ec4934bad9af1390 |
| publicationDate | 2014-01-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201400401-A |
| titleOfInvention | Hybrid integrated component and method of manufacturing same |
| abstract | Several measures are proposed to implement a hybrid integrated component comprising a MEMS component (20) and an ASIC component (10), the capacitor mechanism of which can perform signal detection with relatively high sensitivity and can also be used for the MEMS component The micromechanical structure is sensitively controlled. The hybrid integrated component includes a MEMS component (20) having a micromechanical structure that extends over the entire thickness of the MEMS substrate (20). At least one structural element (23) of the micromechanical structure is deflectable and operatively coupled to at least one capacitor mechanism including at least one movable electrode (51) and at least one stationary electrode (52). The component also includes an ASIC component (10) having at least one electrode (52) of the capacitor mechanism. The MEMS component (20) is mounted to the ASIC component (10) such that there is a gap (21) between the micromechanical structure and the surface of the ASIC component (10). According to the invention, at least one electrode (51) of the capacitor mechanism is detached from the layer structure of the ASIC element (10), and is instead mechanically and electrically connected to the deflectable structural element (23) of the MEMS element (20) such that This electrode (51) serves as the movable electrode (51) of the capacitor mechanism. |
| priorityDate | 2012-04-25^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
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