http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201447029-A

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filingDate 2014-03-12^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0c17d0be8bd323bbc8ebf1920c2e668
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publicationDate 2014-12-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201447029-A
titleOfInvention Plasma CVD device and plasma CVD method
abstract The present invention relates to a plasma CVD apparatus which is a vacuum vessel and a plasma CVD electrode unit and a substrate holding mechanism in a vacuum vessel, the plasma CVD electrode unit having an anode and a cathode opposite to the anode. And a first gas supply nozzle that supplies the gas in a plasma generation space between the anode and the cathode, and the substrate holding mechanism is disposed at a position where the gas passing through the plasma generation space hits, and the gas supply direction of the anode Both the length and the length of the gas supply direction of the cathode are longer than the distance between the anode and the cathode. The present invention provides a plasma CVD apparatus which can improve gas decomposition efficiency and achieve high film formation speed.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I648426-B
priorityDate 2013-03-15^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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