http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201522721-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8a8bad24c6088d7a1deaa523dd4cfff7 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-62 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-48 |
filingDate | 2014-10-16^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abf113d9f54b410845c666b3f26cdd2c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54f028b823a35f55176f22ff07252cef |
publicationDate | 2015-06-16^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-201522721-A |
titleOfInvention | Electrolytic gold plating solution and gold film obtained using the same |
abstract | The electrolytic gold plating solution provided by the present invention maintains mechanical properties, abrasion resistance, electrical properties, and the like, and does not cause appearance defects in the gold plating film, and the precipitation efficiency is higher than that of the conventional gold plating solution, and the precipitation of the gold plating can be shortened. The high-priced gold contained in the time and gold plating solution is low in concentration, which can reduce the production cost.nThe electrolytic gold plating solution provided by the present invention contains a gold cyanide salt as a gold source and a specific pyridinium compound which is bonded to an alkyl group at a nitrogen atom at the 1-position, and is 2 to 6 One to five positions are selected from the group consisting of an alkyl group, an aryl group, a carboxyl group, an alkoxycarbonyl group, a sulfo group, an alkoxysulfonyl group, an amine group, an alkylamino group, a dialkylamino group and a cyano group. One or two or more specific substituents in the group are substituted. Further, the gold film provided by the present invention is obtained by performing electrolytic gold plating on a nickel film using the electrolytic gold plating solution. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I726101-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114836795-A |
priorityDate | 2013-11-25^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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