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filingDate 2014-11-12^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2015-08-01^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201530572-A
titleOfInvention Electronic component and method of manufacturing same
abstract A method of manufacturing an electronic component using an epoxy-containing resin-containing material, and the foregoing manufacturing method comprises the steps of: immersing a component in a material other than a cerium-containing resin, and the argon The resin is added with aluminum hydroxide or magnesium hydroxide in an amount of 60% by weight or more and less than 70% by weight, and a nonpolar solvent; the exposing step is performed to form a material outside the surface of the element. Drying, the non-polar solvent is evaporated, and the silicone resin component is exposed on the surface of the exterior material; and the hardening step is performed to harden the exterior material. Thereby, the non-combustibility and insulation withstand voltage of the exterior material can be maintained, and the silicone resin can be reduced.
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