http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201621024-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C229-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B11-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate | 2015-09-30^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c178f49a40294aa670201b7473eb7898 |
| publicationDate | 2016-06-16^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201621024-A |
| titleOfInvention | Composition |
| abstract | An object of the present invention is to provide a method of polishing a polishing object having a metal wiring layer, even when a specific compound such as periodic acid or ethylenediaminetetraacetic acid (EDTA) is used in combination. A means of suppressing a decrease in the polishing rate.nThe solution of the present invention is that the composition containing the periodic acid or a salt thereof and the first compound having the chemical structure represented by the following Chemical Formula 1 or the following Chemical Formula 2 further comprises a compound represented by the following Chemical Formula 3; a second compound of chemical structure,n□nIn the formula, R represents a chemical structure including a chain containing four or more carbon atoms to which the two closest hydroxyl groups of the compound are linked. |
| priorityDate | 2014-09-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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