| abstract |
An embodiment of the present invention relates to a polishing liquid for CMP for polishing a surface to be polished containing at least a portion containing cobalt and a metal-containing portion containing a metal other than cobalt, and containing abrasive particles, a metal corrosion inhibitor, And water, the pH value is 4.0 or less, and the corrosion potential EA of cobalt is measured in the polishing liquid for CMPnCorrosion potential EB with the metalnCorrosion potential EAnCorrosion potential EBnCorrosion potential difference EAn-EBnThe absolute value is 0 mV to 300 mV. |