http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201637171-A

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publicationDate 2016-10-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201637171-A
titleOfInvention Semiconductor component and method of manufacturing same
abstract A method of fabricating a semiconductor device comprising forming a fin structure on a substrate. An isolation insulating layer is formed to protrude the upper portion of the fin structure from the isolation insulating layer. The gate structure is formed on a portion of the fin structure. A plurality of first recesses are formed in the isolation insulating layer on both sides of the fin structure. The second recess is formed in a portion of the fin structure that is not covered by the gate structure. The depth D1 of the second recess and the depth D2 of the first recess satisfy 0□D1□D2 (but D1 and D2 are not at the same time), wherein the depth D1 and the depth D2 are measured from the uppermost surface of the isolation insulating layer.
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