| abstract |
A photosensitive resin composition comprising a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a polymer selected from the group consisting of two or more selected from the group consisting of The photosensitive resin composition of the one or more alkali-soluble resin and the photosensitive agent which are selected from the copolymer further contains the compound represented by the following general formula (1). The present invention provides a photosensitive resin composition which is excellent in adhesion to a metal material, particularly copper, and exhibits high chemical resistance even when fired at a low temperature.n□ |