| abstract |
The present invention provides a film containing a quinoneimine ring-containing polymer having excellent heat resistance, elongation and resistance, and low dielectric constant even when the precursor polymer is heat-treated at a low temperature. Or a molded body, or an energy-sensitive resin composition containing a film or a molded body of an oxazole ring-containing polymer having excellent heat resistance, stretchability, and chemical resistance; a method for producing the film or the molded body, and a use thereof A method for forming a pattern of the energy-sensitive resin composition, and a permanent film having excellent heat resistance, elongation, and chemical resistance.nAn energy-sensitive resin composition comprising an imidazole compound (A) represented by the formula (1a), a resin precursor component (B), and an energy-sensitive resin composition of a solvent (S), wherein the resin The precursor component (B) is a monomer containing a diamine compound represented by the formula (2), a dicarbonyl compound represented by the formula (3a), and/or a tetracarboxylic dianhydride represented by the formula (3b). The component, and at least one selected from the group consisting of precursor polymers having a repeating unit represented by the formula (4).n□ |