http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201724923-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5f7f120efe096284c7389702c969cf3d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-05 |
| filingDate | 2015-12-22^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e07de9968bb4c3f264c4e8a6df72c24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1c6bc2704737401052bcdd3ee01d475 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e1abc2c31bd16cbf043a900d8c1a57d |
| publicationDate | 2017-07-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201724923-A |
| titleOfInvention | Method for manufacturing laminate |
| abstract | An object of the present invention is to provide a method for producing a laminate of a cured resin layer which is excellent in heat resistance (for example, solder heat resistance) and wiring embedding property and which is effective in preventing defects such as wrinkles or voids. The method of the present invention provides a method for producing a laminate, which is a method for producing a laminate in which a cured resin layer is formed on a substrate, and is characterized by comprising the following steps: On the support having a thickness of 40 to 80 μm, a thickness of 3 to 60 μm and a thickness thinner than the thickness of the support are formed, and the lowest melt viscosity at 80 to 150 ° C is 1 to 400 Pa. a curable resin composition layer composed of a thermosetting resin composition of s to obtain a curable resin composition layer with a support; and a second step of the curable resin composition layer with the support described above The curable resin composition layer is formed on the surface side, and is laminated on the substrate to obtain a composite composed of the substrate and the curable resin composition layer with the support; and in the third step, the composite is heated to The curable resin composition layer is thermally cured to form a cured resin layer, and the fourth step is to peel the support from the cured resin layer. |
| priorityDate | 2015-12-22^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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