http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201736644-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0955bf8807610e8f0af72b9758aa4891
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-62
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56
filingDate 2016-12-27^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea1b6a67579e2bc8bb5aca34cb795707
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d950d8acc5325994b66c0838967fcd3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fe300ee820e965e8a5ca68b8f842b5c
publicationDate 2017-10-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201736644-A
titleOfInvention Hard gold plating solution
abstract The present invention provides a hard gold plating solution which can surely suppress unwanted gold precipitation. The hard gold plating solution is a hard gold plating solution for electrolysis including a gold ion supply raw material, a conductive salt, a distorer, a metal salt containing a gold alloying element, and a gold precipitation controlling agent, and the gold ion supply raw material is 0.5 in terms of gold. g/L~14g/L, when the solution temperature is 25 °C, the specific gravity of the solution is 2°Be'~16°Be', and when the solution temperature is 25°C, the conductivity is 10mS/cm~70mS/cm.
priorityDate 2016-04-07^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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