| abstract |
Provides a variety of composite materials applications such as high-reliability semiconductor sealing materials, electrical and electronic component insulation materials, and laminated boards (printed wiring glass fiber reinforced composite materials) or CFRP (carbon fiber reinforced composite materials). Agents, various coating applications, structural members, etc. useful cisbutadieneimide resin moldings, excellent workability, and low environmental exposure, cisbutadieneimide resin compositions, and cured products thereof . The maleimide resin imide contains a maleimide resin and an organic solvent, and is in the form of a film or a chip. |