| abstract |
The invention discloses a package substrate and a manufacturing method thereof. The package substrate includes: a dielectric material body; a first circuit element disposed in the dielectric material body and having a first connection end and a second connection end located on an upper side of the first circuit element; A second circuit element is disposed in the dielectric material body and has a third connection end located on the upper side of the second circuit element; a first conductive pillar is formed in the dielectric material body and is connected to the first A connection end; a first wire bonding wire connecting the second connection end and the third connection end; and a redistribution layer formed on the dielectric material body and including a first redistribution lead connected to The first conductive post; wherein the first connection end and the second connection end are located at a first depth in the dielectric material body, and the third connection end is located at a second depth in the dielectric material body, And the first depth is different from the second depth. |