abstract |
An object of the present invention is to provide a processing solution and a method for processing a laminated body, which are capable of suppressing the etching of an insulating film while being excellent in removing the hard metal cover and these residues. The processing liquid of the present invention is a processing liquid for a semiconductor device, which contains a fluorine-containing compound and a water-soluble aromatic compound having no benzene ring and having a benzene ring, and has a pH of 5 or less. |