| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5128cfc84a0fb189fceb3cd240c44493 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F12-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 |
| filingDate |
2017-03-30^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0cbe29c58fffd6772772fc1be56184ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29998fafd7291481778e8c3c871149ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_711c65c35e7e045e569cf55601a6e014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ac2b764b29ed4cf7f4c5ff4b2968580 |
| publicationDate |
2018-07-16^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201825557-A |
| titleOfInvention |
Photosensitive resin composition, method for producing cured embossed pattern, and semiconductor device |
| abstract |
The present invention provides a photosensitive resin composition capable of obtaining a resin layer having high adhesion without interposing at the interface between the Cu layer and the photosensitive resin layer after curing after the high temperature storage test, A method of forming a cured embossed pattern of the photosensitive resin composition, and a semiconductor device having the cured embossed pattern. The photosensitive resin composition of the present invention can form a ring-shaped compound having a carbonyl group in a photosensitive resin composition having a specific structure, and can form a hardened void at the interface at the interface with the Cu layer after the high-temperature storage test. membrane. |
| priorityDate |
2016-04-14^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |