| abstract |
A packaging structure includes a substrate, a first lead frame, a first metal layer, at least one wafer, a base, and a second metal layer. The substrate includes a plurality of openings. The first lead frame is embedded in the substrate and includes a plurality of first pads, wherein the opening exposes the first pads. The first metal layer covers the exposed first pad. The chip is disposed on the substrate and is electrically connected to the first metal layer and the first pad. The base is covered on the substrate with a bonding mask. The second metal layer covers a base surface of the base. |