| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_781c429e4e20536916ff74dcbe1b5417 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2255-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2311-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-08 |
| filingDate |
2018-03-26^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_234d9ff72968957446fe9a8e3ebc01df |
| publicationDate |
2018-11-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201838817-A |
| titleOfInvention |
Copper foil with release layer, laminated body, method for producing printed wiring board, and method for manufacturing electronic device |
| abstract |
The present invention provides a copper foil with a mold release layer, which can manufacture embedded circuits, and can effectively suppress the embedded circuits from being corroded when the embedded circuits are exposed by etching. The copper foil with a mold release layer of this invention is equipped with a mold release layer, a copper foil, and a barrier layer in this order. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I808287-B |
| priorityDate |
2017-03-31^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |