http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201840701-A

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filingDate 2018-01-26^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fea66f4f039f332195dd1751fd035dfe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_644d8de44a4886fe996c13bc64e4130a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0198b339b2782affc710a91ab85875c7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e6800949b45b311606e532260ec0cdf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36599660c0904025c67de9d08c9ecfc6
publicationDate 2018-11-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201840701-A
titleOfInvention Curable resin composition, adhesive, quinone imine oligomer, quinone imine oligomer composition, and hardener
abstract An object of the present invention is to provide a fluorene imide oligomer which can be used for a hardened product having a high glass transition temperature after curing and having excellent thermal decomposition resistance, adhesion, and long-term thermal resistance. Another object of the present invention is to provide a curable resin composition containing the fluorene imine oligomer and a fluorene imine oligomer composition, an adhesive containing the curable resin composition, and the fluorene imine. Hardener for oligomer composition.n n n The curable resin composition of the present invention contains a curable resin and a fluorene imine oligomer, and contains a fluorene imine oligomer having a structure represented by the following formula (1-1) and having a number average molecular weight of 900 or more and 4000 or less A polymer and at least one of a fluorene imine oligomer having a structure represented by the following formula (1-2) and having a number average molecular weight of 550 or more and 4,000 or less is used as the fluorene imine oligomer.n n n In formulae (1-1) and (1-2), A is a tetravalent group represented by the following formula (2-1) or (2-2), and in formula (1-1), B It is a divalent group represented by the following formula (3-1) or (3-2). In the formula (1-2), Ar is a divalent aromatic group which may be substituted.n n n In formulas (2-1) and (2-2), * is the bonding position, and in formula (2-1), the Z-based bond, an oxygen atom, or an oxygen atom that may be substituted and may have a bond position Atomic divalent hydrocarbon group. The hydrogen atom of the aromatic ring in the formula (2-1) and the formula (2-2) may be substituted.n n n In formulas (3-1) and (3-2), * is a bonding position, and in formula (3-1), Y is a bonding bond, an oxygen atom, or a divalent hydrocarbon group which may be substituted. The hydrogen atom of the aromatic ring in the formula (3-1) and the formula (3-2) may be substituted.
priorityDate 2017-01-27^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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