http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201843781-A

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filingDate 2017-03-01^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0514ad411db49392190a6e5bdce3bc0
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publicationDate 2018-12-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201843781-A
titleOfInvention Electronic component packaging
abstract An electronic component package includes: a frame including a through hole and a through wiring; an electronic component disposed in the through hole of the frame; a metal plate disposed on the electronic component and a first side of the frame; And a redistribution layer, which is disposed on a second side of the electronic component opposite to the first side and is electrically connected to the electronic component.
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priorityDate 2016-03-31^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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