| abstract |
A method of forming a sequential flow cell may include providing a semiconductor wafer overlying a dielectric layer, and forming a patterned layer on the dielectric layer. The patterned layer has a difference surface, and the difference surface includes first and second surface regions arranged alternately. The method may also include attaching a cover wafer to the semiconductor wafer to form a composite wafer structure, the composite wafer structure including a plurality of flow cells. The composite wafer structure can then be cut to form a plurality of dies. Each crystal grain forms a certain order flow groove. The sequential flow cell may include an inlet, an outlet, and a flow channel between a portion of the patterned layer and a portion of the cover wafer. Furthermore, the method may include functionalizing the sequenced flow cell to create a differential surface. |