http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201920506-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D1-00 |
| filingDate | 2018-09-25^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_264a8cd982bfc2208a9e4f51bdca01f4 |
| publicationDate | 2019-06-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201920506-A |
| titleOfInvention | Paste composition, semiconductor device and electrical ‧ electronic parts |
| abstract | The present invention provides a paste composition for semiconductor bonding and a paste composition for light-emitting device that can bond a semiconductor element and a light-emitting element to a substrate without pressure and have excellent heat dissipation, and can bond a semiconductor element and a light-emitting element well. The present invention is a paste composition, a semiconductor device using the paste composition as a die-bonding paste, and an electrical and electronic part used as a material for attaching a heat dissipation member. The paste composition includes (A) thickness Or silver fine particles with a short diameter of 1 to 200 nm, (B) silver powder other than the above (A) silver fine particles having an average particle size of more than 0.2 μm and less than 30 μm, and (C) a sintering aid containing an acid anhydride structure, and When the total amount of (A) silver fine particles and (B) silver powder is 100 parts by mass, 0.01 to 1 part by mass of (C) sintering auxiliary material is prepared. |
| priorityDate | 2017-09-27^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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