| abstract |
The present invention provides a structure containing a tin (Sn) layer or a Sn alloy layer, the structure including: a substrate (10), a Sn layer or a Sn alloy layer (12) formed on the substrate, and a substrate formed on the substrate (10) The lower barrier metal (11) between the Sn layer or the Sn alloy layer (12) is composed of iron (Fe), cobalt (Co), ruthenium (Ru), rhodium (Rh) ) And a single metal layer composed of any one of palladium (Pd) or an alloy layer composed of two or more of Fe, Co, Ru, Rh and Pd. |