| abstract |
In one aspect, the present invention is a manufacturing method including a first electronic component having a first substrate and a first electrode formed on the first substrate, and having a second substrate and being formed on the second substrate Connecting the step of disposing the first electronic component and the second electronic component via the adhesive layer in such a manner that the adhesive layer is disposed between the second electronic components of the second electrode and the first electrode and the second electrode are electrically connected to each other a manufacturing method of the structure, and the first electronic component further has an insulating layer formed on a side of the first electrode opposite to the first substrate, and the adhesive layer comprises: first conductive particles, which are dendritic conductive particles; And a second conductive particle which is a conductive particle other than the first conductive particle and is a conductive particle having a non-conductive core body and a conductive layer provided on the core body. |