| abstract |
The invention discloses a film-shaped adhesive, which is a semiconductor formed by connecting a first semiconductor element to a substrate by wire bonding via a first wire, and crimping a second semiconductor element onto the first semiconductor element. In the device, a film-shaped adhesive used for crimping a second semiconductor element and burying at least a part of a first lead wire includes a first adhesive film and a second adhesive film laminated on the first adhesive film, and the film is The total amount of the film-shaped adhesive is based on a solvent content of 1.5% by mass or less of the film-shaped adhesive, and the shear viscosity at 80 ° C. of the film-shaped adhesive is 5,000 Pa · s or less. |