| abstract |
The present invention provides an alkali-soluble resin that can obtain a cured film with high elongation, low stress, high metal adhesion, and high heat resistance, and a photosensitive resin composition containing the same. The (A) alkali-soluble resin system of the present invention is characterized by having a structure represented by the general formula (1) and satisfying the following (I) and (II).n n n (I) the general formula (1), X 1, with respect to 100 mole% X 1 and X 2 in total, comprising 30 to 70 mole% of an aliphatic chain having a carbon number of an organic group having 8 to 30, (II) Y 1 as the general formula (1) contains 100 mol% of the total amount of Y 1 and Y 2 and contains 1 to 30 mol% of an organic group having a diphenyl ether structure, (Formula (1), X 1 represents 2 to 100 carbon atoms, a divalent organic group, Y 1 and Y 2 represents 2 to 100 carbon atoms having 2 to 6 monovalent organic group, X 2 represents C2-4 100 tetravalent organic groups, p and q represent integers in the range of 0 to 4, and n 1 and n 2 represent integers in the range of 5 to 100,000). |