| abstract |
The present invention provides a conductive composition for a formed film capable of producing a formed film in which reduction in conductivity due to tensile force is suppressed. A conductive composition for a formed film, comprising a resin (A), conductive fine particles (B), and a solvent (C), wherein the solvent (C) contains 40 parts by mass of 100 parts by mass of the solvent (C) The above solvents (C ') satisfying the following conditions (1) and (2). (1) The boiling point is 180 ° C or higher and 270 ° C or lower. (2) The polarity parameter δp that satisfies the Hansen solubility parameter (HSP) is 0 ≦ δp ≦ 5.0, and the hydrogen bonding parameter δh of the Hansen solubility parameter (HSP) is at least one of 9.8 ≦ δh ≦ 24.0. |