| abstract |
An object of the present invention is to provide a photosensitive resin composition for forming a resist pattern useful as a mask for plating treatment, a method for forming a resist pattern using the photosensitive resin composition, and a A method for manufacturing a plated molded product of a resist pattern formed by the forming method, and a semiconductor device having the plated molded product, the photosensitive resin composition contains: a polymer (A), having the following formula The structural unit (a1) represented by (a1), the structural unit (a2) represented by the following formula (a2), and the structural unit (a3) represented by the following formula (a3); and the photoacid generator (B ). In formula (a3), R 33 represents a hydroxyaryl group. |