| abstract |
A fan-out semiconductor package includes a connection structure including one or more redistribution layers, a first semiconductor chip disposed on a first surface of the connection structure and having a first connection pad, a first encapsulant disposed on a first surface of the connection structure and covering at least a portion of the first semiconductor chip, and a second semiconductor chip disposed on a second surface of the connection structure and having a second connection pad, wherein the first connection pad is electrically connected to the one or more redistribution layers by a connection via of the connection structure, the second connection pad is electrically connected to the one or more redistribution layers by a wire, and the first and second connection pads are electrically connected to each other through the one or more redistribution layers. |