| abstract |
[Problem] Form device wafers without deteriorating quality.n[Solution] A wafer processing method is to divide a wafer on which a plurality of devices are formed into individual device wafers. The aforementioned wafer processing method includes the following steps: a polyester-based sheet arrangement step, and the wafer The circle is positioned in the opening of the frame with the opening for accommodating the wafer, and the polyester-based sheet is arranged on the back or front of the wafer, and the outer periphery of the frame; the integration step, the polyester-based sheet Heat and integrate the wafer and the frame through the polyester-based sheet by thermocompression bonding; in the dividing step, the wafer is irradiated with a laser of a wavelength penetrating the wafer along the planned dividing line The light beam forms a modified layer on the wafer to divide the wafer into individual device wafers; and the pickup step is to heat the polyester-based sheet, push the device wafer up, and pick up the device wafer. |