http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202123556-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_898c6638c74ec88a436f42b11c682f00
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R13-639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02M1-32
filingDate 2019-12-10^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a05fce95461956a98186ad21ceb53dd4
publicationDate 2021-06-16^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-202123556-A
titleOfInvention Power module
abstract Disclosed is a power module which comprises a circuit board, an upper covering member and a lower covering member. The upper covering member is a rectangular body and is recessed from a lower surface thereof. The two inner sidewall surfaces of the upper covering member face each other and each of them has a buckling portion. The bucking portion protrudes in a tapered way from the inner sidewall surface of the upper covering member so as to form an inclined plane thereon. The lower covering member is manufactured by aluminum extrusion. The lower covering member has a rectangular base plate and two buckling plates. Two buckling plates extend side by side from the rectangular base plate. An outer surface of the buckling plate has a corresponding buckling portion which is a groove formed by being recessed inwardly from the outer surface of the buckling plate. The upper covering member is assembled with the lower covering member by buckling the buckling portion to the corresponding buckling portion, wherein the circuit board is disposed in the space between the upper covering member and the lower covering member.
priorityDate 2019-12-10^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268

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