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filingDate 2020-12-08^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0701845e5186301c029508797bd4590
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_438fcae98079307e5eb55eef98f6ad48
publicationDate 2021-09-01^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-202132602-A
titleOfInvention Method for manufacturing a copper-containing layer
abstract A method for manufacturing a copper-containing layer, which has: Step 1: Use a reducing agent to reduce the surface of the substrate (except for the substrate with a silicon oxide compound); and Step 2: Use a copper compound-containing film for formation The raw material is a step of forming a copper-containing layer by plasma atomic layer deposition on the surface reduced in step 1.
priorityDate 2019-12-12^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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