http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-340259-B

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filingDate 1997-07-25^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1998-09-11^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c61e0f3ec1e5749722648a86fde984a0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0306773560f9561c6d3c7e0840f4d6c5
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publicationDate 1998-09-11^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-340259-B
titleOfInvention Manufacturing method of semiconductor devices
abstract A sort of manufacturing method of semiconductor devices, having: step of element formation area for formation of a plurality of elements mutually electrically insulated by means of the element separation insulation film on the main surface of the semiconductor substrate; step of formation of a pair of supply/drain area at said element formation area with respect to said element separation insulation film; step of formation of port electrode with intervention of the port insulation film in the area held by said pair of supply/drain area on said main surface; step of stacking chip growth on the surface of said supply/drain area with formation of selective stacking chip growth of silica, or silica-germanium alloy; step in-element insulation by application onto said semiconductor substrate main surface, with oxidization or removal of the multichip created in said stacking chip growth step for separation and insulation of the stacking chip layers with respect to the elements electrically; and post-insulation step among the elements with formation of in-layer insulation film on the surface of the semiconductor substrate.
priorityDate 1997-04-04^^<http://www.w3.org/2001/XMLSchema#date>
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