| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48453
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05599
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-05042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85447
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85424
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4807 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 |
| filingDate |
2000-02-03^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2001-05-28^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8366b691b58d222eb4288d5235cee6ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f49f6cf972d89d86122ee5376e69b9e6 |
| publicationDate |
2001-05-28^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-437030-B |
| titleOfInvention |
Bonding pad structure and method for making the same |
| abstract |
A bonding pad structure and a method for making the same can be applied on a substrate. The bonding pad structure comprises a metal bonding pad with a pattern on the surface thereof; a first passivation layer with an opening on the top of the metal bonding pad; and a second passivation layer located on the first passivation layer and with an opening on the top of the metal bonding pad. The method for making the bonding pad structure comprises the following steps: forming a metal bonding pad on a substrate; forming a first passivation layer on the substrate; patterning the first passivation layer on the metal bonding pad; using the first passivation layer as a mask to remove a portion of the exposed metal bonding pad; forming a patterned second passivation layer on the substrate, the opening of the second passivation layer is on top of the metal bonding pad; removing the first passivation layer remained on the metal bonding pad in order to fully expose the surface of the metal bonding pad. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110116984-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110116984-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7696626-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102543921-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102543921-A |
| priorityDate |
2000-02-03^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |