http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-464884-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49082 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-102 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-102 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-28 |
| filingDate | 2000-08-16^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2001-11-21^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_414259f25642dabc8fcc2df193b77e8d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b6a846fd7605c059ef1f15050e3af41 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31547e732c1f08158faa59c0733844f0 |
| publicationDate | 2001-11-21^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-464884-B |
| titleOfInvention | Method of fabricating monolithic varistor |
| abstract | A method of fabricating a monolithic chip varistor includes the steps of preparing a varistor body including a plurality of varistor layers and at least one pair of internal electrodes; forming a first layer for each of a pair of external electrodes by applying a metal component and a glass component to an exterior portion of the varistor body, followed by heat treatment; forming a second layer for the external electrode on the first layer by applying a glass component, followed by heat treatment; forming a third layer for the external electrode on the second layer by applying a glass component that is different from the glass component used for forming the second layer, followed by heat treatment; forming a fourth layer for the external electrode on the third layer by applying a metal component that is different from the metal component used for forming the first layer, followed by heat treatment under the same heat treatment conditions as those used for the formation of the first layer; and forming a fifth layer for the external electrode by electroplating. During the heat treatment for forming the fourth layer, the metal component contained in the fourth layer is diffused into the second layer and the third layer. |
| priorityDate | 1999-08-27^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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