| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e9d2eba049b58a95837260bd2901d140 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0796 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41N3-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A62D1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41N3-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23G1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A62C2-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-14 |
| filingDate |
1999-05-26^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2002-01-21^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc372d2464b9bd928842ee544a3bc2f2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae2e210bae9856ac91080d77ff490ae1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e467a70cf60c07c7a11f8eaf51c77121 |
| publicationDate |
2002-01-21^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-473558-B |
| titleOfInvention |
Liquid etchant and method for roughening copper surface |
| abstract |
A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period of time, to thereby ensure firm adhesion between a copper conductive pattern and an outer layer material during manufacturing of a printed circuit board, resulting in the manufacturing being highly simplified. The liquid etchant includes a main component containing an oxo acid such as sulfuric acid and a peroxide such as hydrogen peroxide. Also, the liquid etchant includes an auxiliary component containing a tetrazole such as 5-aminotetrazole or the like, or a 1,2,3-azole. The liquid etchant permits a copper surface to be roughened in an acicular manner. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107304476-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107304476-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I731962-B |
| priorityDate |
1998-06-09^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |