| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate |
1999-04-29^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-05-01^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a61deda83a2e47fac302602e07af3de1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f28610a4b7ee1b3dda92996d2fdf2d3d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e1cad776ffa3aecdb6aec996c4072a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_160e9cf18b08c094b44951f80c27bd0a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d245d2827b04587ed998ef15c87adf2b |
| publicationDate |
2003-05-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-530099-B |
| titleOfInvention |
Electroplating method of a semiconductor substrate |
| abstract |
A semiconductor substrate is first immersed in a first plating solution having composition of good, homogenous electroplating adhesion characteristics and subsequently immersed in a second plating solution having a composition of good leveling characteristics, to prefer a two-step plating process. By the above process, fine indents of grooves of fine circuits patterns of the substrate can be evenly filled with such material having a small electric resistance as copper or copper alloy. |
| priorityDate |
1998-04-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |