| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8b84c9fa3ae2f2e80144712433c6130e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-3355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05H1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-26 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2002-04-16^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-07-21^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64f8acf379868378cd507b3a4f39d015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc77dec7a9760b877e832fc29e0fecbc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c29b5f23f2d7fc74168678f7e810602d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_194743101d435278fa6337c7b0c5c4b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d37f280c1a67bdaca858a529dc2ec807 |
| publicationDate |
2003-07-21^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-543352-B |
| titleOfInvention |
Method and apparatus for fabricating printed circuit board using atmospheric pressure capillary discharge plasma shower |
| abstract |
A method and apparatus for treating a workpiece using capillary discharge plasma are disclosed in the present invention. The method of desmearing holes in a copper laminated board and forming a conductive material in the holes using an atmospheric pressure capillary discharge plasma apparatus includes the steps of drilling the copper laminated board to remove at least a portion of the copper laminated board, placing the copper laminated board having the holes in the apparatus, applying a potential to the plasma generator, providing a working gas in close proximity to the copper laminated board, generating capillary discharge plasma out of the capillary, thereby treating the copper laminated board with the atmospheric pressure capillary discharge plasma to remove resin residues in the holes, and forming the conductive material on the copper laminated board including in the holes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101473707-B |
| priorityDate |
2001-04-17^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |