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filingDate 2002-06-17^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2004-02-21^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-577175-B
titleOfInvention Semiconductor device and process
abstract A gold bump electrode 56 is formed on a pad 53 on a semiconductor substrate 21. The gold bump electrode 56 is formed on the inner side of an opening of a passivation layer 52.
priorityDate 2001-06-28^^<http://www.w3.org/2001/XMLSchema#date>
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