| abstract |
An etchant for copper or copper alloys is disclosed, comprising 5-50 wt% of an alkanolamine, a copper ion source in the amount of 0.2-10 wt% as copper, a halide ion source in the amount of 0.005-10 wt% as halogen, 0.1-30 wt% of an aliphatic carboxylic acid, and the balance water, in which the molar ratio of the alkanolamine to one mol of the aliphatic carboxylic acid is two or more. |