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filingDate 2003-07-24^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-06-11^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3836dd56bcf96188f8bfc7947a6cf8b
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publicationDate 2005-06-11^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I233980-B
titleOfInvention Liquid metal thermal interface for an electronic module
abstract A heat dissipating system utilizes a thin layer of high conductivity liquid metal to provide cooling for electronic sub-assemblies, such as semiconductor chips. The liquid metal preferably is gallium or its alloy which transfers heat form the chip to a heat sink or heat spreader. The system includes one or more vents that allow for filling and venting of the space occupied by the liquid. It also utilizes a flexible seal, such as an O-ring or a membrane held in place with a retainer ring, or a plug that seals the filling vent. The seal flexes to accommodate expansion and contraction of the liquid, as well as phase changes from the liquid phase to the solid phase.
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