| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd83260a96356882b5f50dd097411a72 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate |
2003-04-22^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-07-11^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b6e1a576559f202b872a5e340b8f3d2 |
| publicationDate |
2005-07-11^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I236076-B |
| titleOfInvention |
Semiconductor device and manufacturing process therefor as well as plating solution |
| abstract |
An object of this invention is to improve stress-migration resistance and reliability in a semiconductor device comprising a metal region. In an insulating film 101 is formed a lower interconnection consisting of a barrier metal film 102 and a copper-silver alloy film 103, on which is then formed an interlayer insulating film 104. In the interlayer insulating film 104 is formed an upper interconnection consisting of a barrier metal film 106 and a copper-silver alloy film 111. The lower and the upper interconnections are made of a copper-silver alloy which contains silver to an amount more than a solid solution limit of silver to copper. |
| priorityDate |
2002-04-26^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |