| abstract |
The invention, which relates to a carrier for receiving and electrically contacting individually separated dies (bare chips) for the testing and/or burn-in of the same, the carrier having first contacts, which are arranged in a grid pattern corresponding to the die to be contacted, is based on the object of providing a carrier with which individually separated dies can be mechanically and electrically contacted with precision, to allow the functional testing and burn-in to be carried out with existing equipment, in particular to realize the ""known good die concept"". The object is achieved according to the invention by the first contacts of the carrier being provided with elastomer bumps, which have on the tip second contacts, which are electrically connected to the first contacts, and by the dies being drawn against the elastomer bumps by a predetermined force that is generated by a vacuum. |