| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_af96413821843e2b681f83ae466fceda |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24479
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 |
| filingDate |
2004-06-21^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-03-11^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3c07b1664fdc13906f544efae8e609b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a9dd7c222a15e4649368fe5b7cd0211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_379b091cd570aff7e5ef816ecf9c7127 |
| publicationDate |
2006-03-11^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I251320-B |
| titleOfInvention |
Thermal conductive composition, a heat-dissipating putty sheet and heat-dissipating structure using the same |
| abstract |
The present invention provides a thermal conductive composition formed by blending a thermal conductive filler of not less than 600 mass parts to 100 mass parts of a liquid silicone having a viscosity in a range of 20 to 2000 mPa.s. Since the thermal conductive composition is not crosslinked further or cured at a normal temperature of 25 DEG C, it keeps a putty state, and the thermal conductivity is not less than 3 W/m.K. A heat-dissipating putty sheet according to the present invention is formed by applying the thus obtained thermal conductive composition onto a release sheet. The heat-dissipating putty sheet having a thickness ranging from 0.5 mm to 3 mm can be released manually from a release base, or it can be transferred from a release sheet to a heat-generating part or a dissipator so as to be attached to a desired position easily. |
| priorityDate |
2003-07-04^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |