| abstract |
A wafer structure with solder bump and a method for producing the same are described. The wafer structure with solder bump includes a chip, a plurality of pads arranged on a surface of the chip, a protection layer formed on the surface of the chip and exposing the pads, a first photo-imaginable dielectric coating covered on the protection layer, a plurality of UBMs arranged on the pads, and extends over the first photo-imaginable dielectric coating respectively, a second photo-imaginable dielectric coating covered on the UBMs and the first photo-imaginable dielectric coating, and a plurality of conductive balls relative to the pads and disposed on the UBMs respectively. Each UBM has a heat-dissipation portion extending forwards a periphery edge of the surface of the chip. The second photo-imaginable dielectric coating reveals the heat-dissipation portions respectively. Therefore, an effective heat dissipation can be met by the direct reveled heat-dissipation portion or by a further heat-dissipation bump disposed over the heat-dissipation portion. |