| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-179
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-13452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09909
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4664
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76825 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1258
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4867
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2005-08-29^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-11-01^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_878f969c7ffb26859a2db799b7d44dc5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a942c5bbdc2742a2ccc0d45f8b490439
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0665e2eb608f10339ec3a27ff696351d |
| publicationDate |
2007-11-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I289419-B |
| titleOfInvention |
Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic device |
| abstract |
A wiring pattern formation method in which a wiring pattern is formed by arranging, in a region which is demarcated by a partition wall, liquid material which includes an electrically conductive material, including: arranging a resin material around the periphery of a region upon which the wiring pattern is to be formed; imparting liquid affinity to a demarcated region which has been demarcated by the resin material; narrowing down the demarcated region by flowing out the resin material towards and into the demarcated region; and forming the partition wall by curing the resin material. |
| priorityDate |
2004-09-28^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |