http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I409367-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8a8bad24c6088d7a1deaa523dd4cfff7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-48 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-48 |
| filingDate | 2009-06-08^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-09-21^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba8ff8f4b2b7e52daa49f14f4888bda7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4bc6fedca3ee855419f5d9e4a6847578 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abf113d9f54b410845c666b3f26cdd2c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdcca1ae1053fd0479f4feaa6a04c0ee http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b2fea86742aea9d50a06bc4f7aed25a |
| publicationDate | 2013-09-21^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I409367-B |
| titleOfInvention | Electrolytic gold plating and the use of its gold film |
| abstract | The problem is to provide an electrolytic gold plating solution suitable for nickel barrier plating while maintaining the excellent properties of the gold plating film, e.g., mechanical characteristics, corrosion resistance, and electrical characteristics, that is, the problem is to provide an electrolytic gold plating solution capable of manufacturing a stable product that limits gold deposition at 'portions not requiring gold plating (nickel barrier portions)' where members are mechanically constrained, and ensures satisfactory gold deposition in portions requiring gold plating, without extraneous deposition of the gold. The aforementioned problem is solved by means of an electrolytic gold plating solution that contains a gold cyanide salt as the gold source, and a heterocyclic compound having one or more nitrogen atoms in the ring and one or more nitro groups replacing a carbon atom in said ring, and by means of a gold film that is obtained by electrolytic gold plating onto a nickel film using the aforementioned electrolytic gold plating solution. |
| priorityDate | 2008-06-11^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
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