| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a9f3de921f660072c991b77067ea46c5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1089
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1262 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58 |
| filingDate |
2010-06-21^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-11-21^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7349b2aa7b5cecbd28bd7ece3ca96099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ec962e136f0f210660d43e6f001cfa7 |
| publicationDate |
2013-11-21^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I416638-B |
| titleOfInvention |
Method of mounting a wafer mounter to a substrate |
| abstract |
A method of providing chiplets over a substrate including providing in sequence a substrate; coating an adhesive in a layer over the substrate; placing a plurality of first chiplets onto the adhesive layer in separated chiplet location(s) to adhere the first chiplets to the adhesive layer, wherein one or more of the first chiplets do not adhere to the adhesive layer, so that first chiplet(s) are adhered to the adhesive layer in adhered chiplet location(s) and first chiplet(s) are not adhered in non-adhered chiplet location(s); locally processing the adhesive layer in the non-adhered chiplet location(s) to condition the adhesive layer in the non-adhered locations to receive second chiplets; placing second chiplet(s) onto the adhesive layer in the conditioned non-adhered chiplet location(s) to adhere the second chiplets in the adhesive layer in the non-adhered locations; and curing the adhesive. |
| priorityDate |
2009-06-23^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |