patent/TW-I508194-B

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I508194-B

Outgoing Links

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classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00325 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
filingDate	2009-12-30^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2015-11-11^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78ada075cb15739b0970612c42b9147f
publicationDate	2015-11-11^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-I508194-B
titleOfInvention	Electronic component package and manufacturing method thereof
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I606560-B
priorityDate	2009-01-06^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID420170063 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID15257393

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