| abstract |
Some embodiments of the present disclosure provide structures and methods. The structure includes an integrated circuit die, which is packaged at least from the side, and a redistribution structure on the integrated circuit die and the package. The redistribution structure is electrically coupled to the integrated circuit die. The redistribution structure includes at least a first dielectric layer on the package, a metallization pattern on the first dielectric layer, a metal oxide layered structure on the metallization pattern, and the first dielectric layer and the metal The second dielectric layer on the pattern. The metal oxide layered structure includes a metal oxide layer, the metal oxide layer has a ratio of metal atoms to oxygen atoms of substantially 1: 1, and the thickness of the metal oxide layer is at least 50Å. The second dielectric layer is a light-sensitive material. The metal oxide layered structure is located between the metallization pattern and the second dielectric layer. |